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Advanced Characterization Systems
A Showcase of Maury Systems Integration Know-How

Over the years, Maury has produced some of the most advanced and sophisticated RF & microwave device characterization systems in the world.

Our team of expert engineers and technicians have an unrivaled pool of knowledge, skill, and experience in combining diverse test and measurement instruments, components and auxiliary equipment into completely integrated, turnkey systems. We work closely with our customers to determine the best solutions for their specific applications and can bring all of the necessary system components together, set up the test bench, verify that everything works as it should, then deliver and install it on-site, and hand it over ready to begin operation.

Combine that with Maury's outstanding after sale technical support, and calibration and repair services, and you have the right team on your side. On this page we showcase one of the advanced systems that have earned us our reputation as the best in the industry.


Millimeter-Wave Device Characterization Systems
Fully Integrated by Maury Engineers, 250 MHz to 110 GHz

Features
Power, noise parameter, and intermod measurements
Packaged and on-wafer measurements
Modulated, pulsed and CW signals
Automated in-situ calibration
Fewer connections
Reliable and fast RF switching
Saves time and money
Turnkey systems available for coaxial and waveguide


24mm Load Pull Device Characterization System Integration
Fully Integrated by Maury Engineers, 8 to 50 GHz

Features
Complete s-parameter, noise parameter, and x-parameter measurements
Packaged and on-wafer measurements
Automated in-situ calibration
Fewer connections
Reliable and fast RF switching
Saves time and money
Turnkey systems available


Real-time IR Load Pull Systems for PA and High-power Transistor Design
Fully Integrated by Maury Engineers

Features
Real-time thermal analysis versus source and load impedance, frequency, and bias
Thermal resistance, non-uniform V-I, and current measurements
Packaged device measurements
Optimization of die layout and ballast for:
Improved effective power density
Improved PAE, gain, and linearity
Improved ruggedness


Specific customer needs and specifications can be addressed through customization. Further information is available from our Sales Department.

Application Note 5A-039 (333 KB)

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